최신Apple Service Fundamentals - SVC-16A무료샘플문제
문제1
Identify the memory module technology used by the MacBook Air (11-inch, Mid 2013) and MacBook Air
(13-inch, Mid 2013).
Identify the memory module technology used by the MacBook Air (11-inch, Mid 2013) and MacBook Air
(13-inch, Mid 2013).
정답: C
문제2
Before leaving your bench to take a logic board to a storage place, where should you place the logic board?
Before leaving your bench to take a logic board to a storage place, where should you place the logic board?
정답: C
문제3
The iMac (Late 2012, Early 2013, and Late 2013) display panel is secured to the rear enclosure using adhesive strips. Which of the following tools should be used to cut these strips?
The iMac (Late 2012, Early 2013, and Late 2013) display panel is secured to the rear enclosure using adhesive strips. Which of the following tools should be used to cut these strips?
정답: A
문제4
Which of the following Mac Pro (Late 2013) parts has a slot for flash storage?
Which of the following Mac Pro (Late 2013) parts has a slot for flash storage?
정답: A
문제5
To power on the system, which of the following can be used on the MacBook Pro (Retina, Mid 2012) and
MacBook Pro (Retina, 15-inch, Early 2013 and Late 2013) logic boards?
To power on the system, which of the following can be used on the MacBook Pro (Retina, Mid 2012) and
MacBook Pro (Retina, 15-inch, Early 2013 and Late 2013) logic boards?
정답: D
문제6
Remaining residue from Very High Bond (VHB) adhesive should only be removed with which of the following:
Remaining residue from Very High Bond (VHB) adhesive should only be removed with which of the following:
정답: C,E